Faster than the existing chiptochip communication bandwidth
Posted: Tue Feb 18, 2025 5:54 am
80 times
Thanks to the advancement of chip technology in recent years, more and denser transistors can be accommodated on a chip; for example, IBM's 2 nanometer chip technology can implant more than 50 billion transistors on a single chip. Opticalelectronic copackaging technology aims to expand the interconnection density between accelerators, helping chipmakers add optical pathways connecting chips to electronic modules, thereby exceeding the limitations of existing electronic pathways. The new highbandwidthdensity optical structure described in the IBM paper and other innovations, such as transmitting multiple wavelengths through each optical channel, are expected to increase the bandwidth of chiptochip communications to 80 times that of wire connections .
IBM's innovation could allow chipmakers to add six times more optical russia phone number list fibers , or socalled "beachfront density," around the edge of a silicon photonics chip compared to current stateoftheart optoelectronic copackaging technology. Each optical fiber is about three times the width of a human hair and ranges in length from a few centimeters to hundreds of meters, capable of transmitting trillions of bits of data per second. The IBM team used standard packaging processes to package highdensity polymer optical waveguides PWGs on optical channels with a pitch of 50 microns and adiabatically coupled them with silicon photonic waveguides.
Thanks to the advancement of chip technology in recent years, more and denser transistors can be accommodated on a chip; for example, IBM's 2 nanometer chip technology can implant more than 50 billion transistors on a single chip. Opticalelectronic copackaging technology aims to expand the interconnection density between accelerators, helping chipmakers add optical pathways connecting chips to electronic modules, thereby exceeding the limitations of existing electronic pathways. The new highbandwidthdensity optical structure described in the IBM paper and other innovations, such as transmitting multiple wavelengths through each optical channel, are expected to increase the bandwidth of chiptochip communications to 80 times that of wire connections .
IBM's innovation could allow chipmakers to add six times more optical russia phone number list fibers , or socalled "beachfront density," around the edge of a silicon photonics chip compared to current stateoftheart optoelectronic copackaging technology. Each optical fiber is about three times the width of a human hair and ranges in length from a few centimeters to hundreds of meters, capable of transmitting trillions of bits of data per second. The IBM team used standard packaging processes to package highdensity polymer optical waveguides PWGs on optical channels with a pitch of 50 microns and adiabatically coupled them with silicon photonic waveguides.